Concepedia

Co-design Of Package

Co-Design of Package is a microwave packaging methodology that integrates the concurrent optimization of package and system-level components to achieve enhanced electromagnetic, thermal, and mechanical performance beyond what is attainable through sequential design approaches.

17

Publications

400

Citations

69

Authors

21

Institutions

Publications per year

2017–2026

2

Parents

Publications

17

Compact Physical IR-Drop Models for Chip/Package Co-Design of Gigascale Integration (GSI)

K. Shakeri, J.D. Meindl · IEEE Transactions on Electron Devices · 2005 · 79 citations

, , +17

Flip-chip routing with unified area-I/O pad assignments for package-board co-design

Jiawei Fang, Martin D. F. Wong, Yao‐Wen Chang · 2009 · 48 citations

, , +17

Area-I/O flip-chip routing for chip-package co-design

Jiawei Fang, Yao‐Wen Chang · 2008 · 38 citations

, , +16

Area-I/O Flip-Chip Routing for Chip-Package Co-Design Considering Signal Skews

Jiawei Fang, Yao‐Wen Chang · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2010 · 32 citations

, , +17

Compact Physical Models for Power Supply Noise and Chip/Package Co-Design of Gigascale Integration

Gang Huang, Deepak Sekar, Azad Naeemi et al. · 2007 · 24 citations

, , +17

1–5 of 17

Authors

69

  1. YC
    Yao‐Wen Chang

    National Taiwan University, Taiwan

    4 publications · 140 citations

    4

    h-index

  2. JF
    Jiawei Fang

    National Taiwan University, Taiwan

    4 publications · 140 citations

    4

    h-index

  3. JM
    J.D. Meindl

    Georgia Institute of Technology, United States

    2 publications · 103 citations

    2

    h-index

  4. EB
    Eric Beyne

    IMEC, Belgium

    2 publications · 28 citations

    2

    h-index

  5. HS
    Haiyan Sun

    Nantong University, China

    1 publications · 12 citations

    1

    h-index

1–5 of 69

Institutions

21

  1. National Taiwan University

    Taipei, Taiwan

    4 h-index

    8 publications

    280 citations

  2. KU Leuven

    Leuven, Belgium

    2 h-index

    19 publications

    266 citations

  3. IMEC

    Leuven, Belgium

    2 h-index

    24 publications

    336 citations

  4. Cypress Semiconductor Corporation (United States)

    San Jose, United States

    2 h-index

    2 publications

    103 citations

  5. Georgia Institute of Technology

    Atlanta, United States

    2 h-index

    6 publications

    199 citations

  6. Cypress Semiconductor Corporation (Japan)

    Kawasaki, Japan

    1 h-index

    1 publications

    79 citations

  7. Institute of Microelectronics

    Singapore, Singapore

    1 h-index

    4 publications

    64 citations

  8. National Sun Yat-sen University

    Kaohsiung City, Taiwan

    1 h-index

    4 publications

    64 citations

1–8 of 21

Venues

  1. 2

    h-index

  2. IEEE Transactions on Electron Devices

    1 publications · 79 citations

    1

    h-index

  3. IBM Journal of Research and Development

    1 publications · 16 citations

    1

    h-index

  4. Journal of Electronic Packaging

    1 publications · 17 citations

    1

    h-index

  5. 1

    h-index

1–5