IEEE Transactions on Electron Devices · 1997 · 28 citations · 12 references
EngineeringMaterials EngineeringMaterials Science3D ModelingSurface EngineeringSurface ScienceSurface ModelingSurface RoughnessSurface TopographyTopographic AnalysisTopographic ModelingTopographic Models3D Surface ModelingSputter DepositionThree-dimensional Surface ModelingThree-dimensional Surface TopographyTopographic Surface Modeling
This paper presents a three-dimensional (3-D) topography simulator (3-D MULSS), and its applications. We focus on the description of the material surface and the algorithm of the surface advancement. Then we propose a 3-D topography simulation algorithm, with consideration of the probe size of observation, and based on the integration formula of the balance equation. Next, we show the simulation results of the 3-D MULSS: (1) isotropic deposition; (2) Aluminum-sputter deposition; (3) isotropic etching; (4) anisotropic etching; and (5) sequential process steps. These results make the accuracy of the 3-D MULSS clear, and also show that it is possible to stably simulate the sequential process steps.
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Free Energy of a Nonuniform System. I. Interfacial Free Energy
John W. Cahn, J. E. Hilliard · The Journal of Chemical Physics · 1958 · 10.3K citations
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W.G. Oldham, S.N. Nandgaonkar, Andrew R. Neureuther et al. · IEEE Transactions on Electron Devices · 1979 · 216 citations
Engineering, Computer Engineering, Electrical Engineering +15
W.G. Oldham, Andrew R. Neureuther, Chiakang Sung et al. · IEEE Transactions on Electron Devices · 1980 · 121 citations
Engineering, Electrical Engineering, Manufacturing Engineering +17