Publication | Closed Access
Embedded Deterministic Test
518
Citations
36
References
2004
Year
EngineeringMem TestingVerificationComputer ArchitectureTest Data GenerationEmbedded SystemsSoftware AnalysisFormal VerificationHardware SecurityComputational TestingCompression SchemesTest BenchTesting TechniqueComputer EngineeringBuilt-in Self-testComputer ScienceEdt SchemeDesign For TestingProgram AnalysisSoftware TestingFormal MethodsDeterministic Test
The scheme is widely applicable and easy to deploy because it is based on standard scan/ATPG methodology and a very simple flow. The paper introduces the embedded deterministic test (EDT), a test‑data volume‑compression method that cuts scan data volume and test time by one to two orders of magnitude. EDT embeds logic on‑chip and employs a deterministic test‑pattern generation technique that repeats patterns at rates tuned to test‑cube requirements, without modifying core logic. Experiments on industrial circuits with 0.2–3% fill rates show compression ratios of 30–500×, and a comprehensive encoding‑efficiency analysis is provided.
This paper presents a novel test-data volume-compression methodology called the embedded deterministic test (EDT), which reduces manufacturing test cost by providing one to two orders of magnitude reduction in scan test data volume and scan test time. The presented scheme is widely applicable and easy to deploy because it is based on the standard scan/ATPG methodology and adopts a very simple flow. It is nonintrusive as it does not require any modifications to the core logic such as the insertion of test points or logic bounding unknown states. The EDT scheme consists of logic embedded on a chip and a new deterministic test-pattern generation technique. The main contributions of the paper are test-stimuli compression schemes that allow us to deliver test data to the on-chip continuous-flow decompressor. In particular, it can be done by repeating certain patterns at the rates, which are adjusted to the requirements of the test cubes. Experimental results show that for industrial circuits with test cubes with very low fill rates, ranging from 3% to 0.2%, these schemes result in compression ratios of 30 to 500 times. A comprehensive analysis of the encoding efficiency of the proposed compression schemes is also provided.
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