Low profile integrated passive devices with 3D high density capacitors ideal for embedded and die stacking solutions

Abstract

• The low profile IPDIA technology capability is limited by the density of the trench capacitor, more explicitly by the depth of the trench. • The 80μm Low Profile node dedicated to the highest capacitor density is qualified. • IPDIA is providing the lowest profile 3D Silicon capacitors with a superior stability and reliability over a wide temperature range. • Ideal solution where volume and weight are major concerns.