The effect of strain on abnormal grain growth in Cu thin films

Interfacial phenomena in metals and alloys

Materials Chemistry · 1978 · 1.6K citations

Natural Sciences, Materials Engineering, Materials Science +12

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 359 citations

Natural Sciences, Materials Engineering, Materials Science +17

Grain Growth and Stress Relief in Thin Films

P. Chaudhari · Journal of Vacuum Science and Technology · 1972 · 314 citations

Natural Sciences, Materials Engineering, Materials Science +16

Treatise on Materials Science and Technology

Iain May · Metallography · 1981 · 278 citations

Natural Sciences, Materials Engineering, Materials Science +17

Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature

C. Lingk, M. E. Gross · Journal of Applied Physics · 1998 · 205 citations

Engineering, Materials Engineering, Materials Science +16