Development of Ni/Al and Ni/Ti/Al ohmic contact materials for p-type 4H-SiC

Ryohei Konishi, Ryuichi Yasukochi, Osamu Nakatsuka, +3

Materials Science and Engineering B

Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringNanoelectronics +3

Microstructure of amorphous tantalum nitride thin films

Susumu Tsukimoto, Miki Moriyama, Masanori Murakami

Thin Solid Films

Materials ScienceEngineeringApplied PhysicsThin FilmsAmorphous Solid +2

Formation of Ti diffusion barrier layers in Thin Cu(Ti) alloy films

Susumu Tsukimoto, Tomoaki MORITA, Miki Moriyama, +2

Journal of Electronic Materials

Materials ScienceMaterials EngineeringThin CuEngineeringDiffusion Resistance +7

Correlation between the electrical properties and the interfacial microstructures of TiAl-based ohmic contacts to p-type 4H-SiC

Susumu Tsukimoto, Koji Nitta, T. Sakai, +2

Journal of Electronic Materials

Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringNanoelectronics +9

Correlation between microstructure and barrier properties of TiN thin films used Cu interconnects

Miki Moriyama, T. Kawazoe, M. Tanaka, +1

Thin Solid Films

Materials ScienceEngineeringApplied PhysicsCu InterconnectsTin Thin Films +6

Properties of TiO2-based transparent conducting oxide thin films on GaN(0001) surfaces

Junpei Kasai, Taro Hitosugi, Miki Moriyama, +5

Journal of Applied Physics

Optical MaterialsEngineeringTio2-based TransparentOptoelectronic DevicesSemiconductors +15

Electrical resistivity of polycrystalline Cu interconnects with nano-scale linewidth

Masahiro Shimada, Miki Moriyama, Kazuhiro Ito, +2

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

Materials SciencePolycrystalline CuElectrical EngineeringElectromigration TechniqueMs Model +12

The Effect of Strain Distribution on Abnormal Grain Growth in Cu Thin Films

Miki Moriyama, Kentaro Matsunaga, Toshifumi Morita, +2

MATERIALS TRANSACTIONS

EngineeringSevere Plastic DeformationChemical DepositionCu Thin FilmsIntrinsic Strain +18

The effect of strain on abnormal grain growth in Cu thin films

Miki Moriyama, K. Matsunaga, Masanori Murakami

Journal of Electronic Materials

Materials ScienceEngineeringSevere Plastic DeformationAbnormal Grain GrowthThin Film Processing +7

Effect of Annealing Atmosphere on Void Formation in Copper Interconnects

Shinya Konishi, Miki Moriyama, Masanori Murakami

MATERIALS TRANSACTIONS

Cu FilmsEngineeringWater VaporVacuum DeviceVoid Growth +15