Miki Moriyama

Development of Ni/Al and Ni/Ti/Al ohmic contact materials for p-type 4H-SiC

Ryohei Konishi, Ryuichi Yasukochi, Osamu Nakatsuka et al. · Materials Science and Engineering B · 2003 · 95 citations

Materials Science, Materials Engineering, Electrical Engineering +5

Microstructure of amorphous tantalum nitride thin films

Susumu Tsukimoto, Miki Moriyama, Masanori Murakami · Thin Solid Films · 2004 · 87 citations

Materials Science, Engineering, Applied Physics +4

Formation of Ti diffusion barrier layers in Thin Cu(Ti) alloy films

Susumu Tsukimoto, Tomoaki MORITA, Miki Moriyama et al. · Journal of Electronic Materials · 2005 · 79 citations

Materials Science, Materials Engineering, Thin Cu +9

Correlation between the electrical properties and the interfacial microstructures of TiAl-based ohmic contacts to p-type 4H-SiC

Susumu Tsukimoto, Koji Nitta, T. Sakai et al. · Journal of Electronic Materials · 2004 · 76 citations

Materials Science, Materials Engineering, Electrical Engineering +11

Correlation between microstructure and barrier properties of TiN thin films used Cu interconnects

Miki Moriyama, T. Kawazoe, M. Tanaka et al. · Thin Solid Films · 2002 · 75 citations

Materials Science, Engineering, Applied Physics +8