Correlation between microstructure and barrier properties of TiN thin films used Cu interconnects - Concepedia

Concepedia

Publication | Closed Access

Correlation between microstructure and barrier properties of TiN thin films used Cu interconnects

75

Citations

18

References

2002

Year

Miki Moriyama, T. Kawazoe, M. Tanaka, Masanori Murakami

Thin Solid Films

Materials ScienceEngineeringApplied PhysicsCu InterconnectsTin Thin FilmsBarrier PropertiesSemiconductor MaterialThin FilmsChemical Vapor DepositionThin Film ProcessingMicrostructure

References

	Year	Citations

Page 1