Low-temperature crystallization and electrical properties of BST thin films using excimer laser annealing

SOP: What Is It and Why? A New Microsystem-Integration Technology Paradigm-Moore's Law for System Integration of Miniaturized Convergent Systems of the Next Decade

Rao Tummala · IEEE Transactions on Advanced Packaging · 2004 · 271 citations

Engineering, Computer Engineering, Electrical Engineering +17

Abrupt Appearance of the Domain Pattern and Fatigue of Thin Ferroelectric Films

A. M. Bratkovsky, A. P. Levanyuk · Physical Review Letters · 2000 · 249 citations · Full text

Natural Sciences, Materials Science, Physics +10

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

John Knickerbocker, Paul Andry, L.P. Buchwalter et al. · IBM Journal of Research and Development · 2005 · 236 citations

Engineering, Computer Engineering, Electrical Engineering +17

The SOP for Miniaturized, Mixed-Signal Computing, Communication, and Consumer Systems of the Next Decade

Rao Tummala, Madhavan Swaminathan, Manos M. Tentzeris et al. · IEEE Transactions on Advanced Packaging · 2004 · 152 citations

Engineering, Computer Engineering, Electrical Engineering +15

PVD HfO₂ for high-precision MIM capacitor applications

Sun Jung Kim, Byung Jin Cho, Ming Fu Li et al. · IEEE Electron Device Letters · 2003 · 58 citations

Natural Sciences, Electrical Engineering, Materials Science +13