Effective suppression of electromigration-induced Cu dissolution by using Ag as a barrier layer in lead-free solder joints

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Cheng–En Ho, Shenghao Yang, C. R. Kao · Journal of Materials Science Materials in Electronics · 2006 · 272 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

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Natural Sciences, Electrical Engineering, Materials Science +16

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

T. Y. Lee, K. N. Tu, D. R. Frear · Journal of Applied Physics · 2001 · 226 citations

Engineering, Electrical Engineering, Materials Engineering +12

Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions

Sinn-wen Chen, Chih‐Ming Chen, Wen-Chyuarn Liu · Journal of Electronic Materials · 1998 · 203 citations

Natural Sciences, Materials Science, Physics +14

Phase equilibria and solidification properties of Sn-Cu-Ni alloys

Chih‐Hao Lin, Sinn-wen Chen, Chao-hong Wang · Journal of Electronic Materials · 2002 · 164 citations

Engineering, Materials Engineering, Materials Science +16