Self-aligned implanted ground-plane fully depletedSOI MOSFET

Weize Xiong, J.-P. Colinge

Electronics Letters · 1999 · 38 citations · 1 references

Concepts

Abstract

A method for fabricating a back-gate ground plane underneath a thin-film silicon-on-insulator (SOI) MOSFET is described. It is shown by numerical simulation that the formation of the ground plane improves the subthreshold slope and short-channel characteristics of very short-channel devices.

References

1