Phase Evolution in the AuCu/Sn System by Solid-State Reactive Diffusion

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

Natural Sciences, Materials Engineering, Materials Science +12

Reaction-Diffusion in the Cu–Sn System

Masami Onishi, Hideo Fujibuchi · Transactions of the Japan Institute of Metals · 1975 · 235 citations · Full text

Natural Sciences, Materials Science, Physics +14

Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System

Aloke Paul, C. Ghosh, W. J. Boettinger · Metallurgical and Materials Transactions A · 2011 · 167 citations

Natural Sciences, Materials Engineering, Materials Science +16

Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions

Riet Labie, Wouter Ruythooren, Jan Van Humbeeck · Intermetallics · 2006 · 134 citations

Engineering, Materials Engineering, Materials Science +17

Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433–473K

Takeshi Takenaka, Satoru S. Kano, Masanori Kajihara et al. · Materials Science and Engineering A · 2005 · 109 citations

Natural Sciences, Materials Engineering, Materials Science +14