Concepedia

Mechanical properties and microstructural characterization of Al-0.5%Cu thin films

Ramnath Venkatraman, J. C. Bravman, William D. Nix, Paul W. D Avies, Paul A. Flinn, David B. Fraser

Journal of Electronic Materials · 1990 · 110 citations · 10 references

DOI

Concepts

References

10

Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history

P. A. Flinn, Donald S. Gardner, William D. Nix · IEEE Transactions on Electron Devices · 1987 · 586 citations

, , +17

Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques

M. Doerner, Donald S. Gardner, William D. Nix · Journal of materials research/Pratt's guide to venture capital sources · 1986 · 343 citations

, , +14

Grain Growth and Stress Relief in Thin Films

P. Chaudhari · Journal of Vacuum Science and Technology · 1972 · 314 citations

, , +16

The Stability of a Dislocation Threading a Strained Layer on a Substrate

L. B. Freund · Journal of Applied Mechanics · 1987 · 271 citations

, , +17

A new x-ray diffractometer design for thin-film texture, strain, and phase characterization

P. A. Flinn, Glenn A. Waychunas · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 1988 · 90 citations

, , +16