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Ta2O5 Interfacial Layer between GST and W Plug enabling Low Power Operation of Phase Change Memories
29
Citations
3
References
2006
Year
Unknown Venue
EngineeringComputer ArchitectureHeat InsulatorPhase-change MemoriesPhase Change MemoryNovel Memory CellElectronic DevicesMemory DeviceMemory DevicesPhase-change MemoryPower Electronic DevicesElectrical EngineeringElectronic MemoryComputer EngineeringMicroelectronicsMemory ReliabilityTa2o5 Interfacial LayerApplied PhysicsPhase Change MemoriesW Plug
A novel memory cell for phase-change memories (PCMs) that enables low-power operation has been developed. Power (i.e., current and voltage) for the cell is significantly reduced by inserting a very thin Ta <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</sub> film between GeSbTe (GST) and a W plug. The Ta <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</sub> interfacial layer works not only as a heat insulator enabling effective heat generation in GST but also as an adhesion layer between GST and SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> underneath. Nonetheless, sufficient current flows through the interfacial layer due to direct tunneling. A low programming power of 1.5 V/100 muA can therefore be obtained even on a W plug with a diameter of 180 nm fabricated using standard 0.13-mum CMOS technology. In addition, the uniformity and repeatability of cell resistance are excellent because of the inherently stable Ta <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</sub> film properties
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