Electrochemical and Solid-State Letters · 2007 · 40 citations · 20 references
Natural SciencesChemistryMaterials ScienceElectrochemical EngineeringElectrochemistryPolymer ChemistryElectrochemical KineticsElectrode KineticsElectrode MaterialsElectrode-electrolyte InterfacesWorking ElectrodesAdditivesAdsorption At Electrochemical InterfacesAdsorption KineticsElectrochemical Reaction KineticsElectrode ProcessesElectrodepositionPlatingSuppression
Adsorption studies of polyvinylpyrrolidone (PVP) during potentiostatic copper electrodeposition in the presence of common plating additives are presented. Experiments were conducted using a flow-through microfluidic electrochemical cell. Results show that in the presence of chloride ions, PVP adsorption characteristics are similar to those of polyethylene glycol (PEG), with very fast suppression achieved at PVP concentrations above . In contrast to PEG, PVP inhibits deposition rates even on electrodes in which Cu has been predeposited in the presence of bis(sulfopropyl)disulfide.
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