Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

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IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms

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Natural Sciences, Materials Engineering, Materials Science +9

Evolution of the microstructure of Sn–Ag–Cu solder joints exposed to ultrasonic waves during solidification

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Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature

Babak Arfaei, N. Kim, E. J. Cotts · Journal of Electronic Materials · 2011 · 103 citations

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Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In

A.A. El-Daly, A.E. Hammad · Journal of Alloys and Compounds · 2011 · 98 citations

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