Concepedia
Journal of Crystal Growth · 2000 · 14 citations · 4 references
Interface VoidsElectrical EngineeringOptical MaterialsEngineeringPhysicsInfrared SensorOptical PropertiesSpectroscopyNatural SciencesApplied PhysicsInfrared SpectroscopyOptical TestingSilicon Wafer BondingInfrared OpticMicroelectronicsOptoelectronics
4
Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom Environment
R. Stengl, K.-Y. Ahn, U. Gösele · Japanese Journal of Applied Physics · 1988 · 96 citations
Engineering, Mechanical Engineering, Integrated Circuits +16
Causes and Prevention of Temperature-Dependent Bubbles in Silicon Wafer Bonding
Kiyoshi Mitani, Volker Lehmann, R. Stengl et al. · Japanese Journal of Applied Physics · 1991 · 86 citations
Engineering, Silicon On Insulator, Bubble Nucleation +16
Bubble-Free Wafer Bonding of GaAs and InP on Silicon in a Microcleanroom
V. Lehmann, Kiyoshi Mitani, R. Stengl et al. · Japanese Journal of Applied Physics · 1989 · 56 citations
Bubble-free Wafer Bonding, Engineering, Silicon On Insulator +17
Low‐Temperature Preparation of Silicon/Silicon Interfaces by the Silicon‐to‐Silicon Direct Bonding Method
Stefan Bengtsson, Olof Engström · Journal of The Electrochemical Society · 1990 · 28 citations
Silicon/silicon Interfaces, Engineering, Integrated Circuits +19