Comparison of different flex materials in high density flip chip on flex applications

Printed Circuits Handbook

Martin Goosey · Circuit World · 2010 · 160 citations

Electrical Engineering, Engineering, Circuit System +4

Adhesive flip chip bonding on flexible substrates

R. Aschenbrenner, R. Miessner, H. Reichl · 1997 · 38 citations

Materials Science, Electrical Engineering, Engineering +15

Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

Z.W. Zhong · Microelectronics International · 1999 · 37 citations

Materials Science, Advanced Packaging, Electrical Engineering +14

The evaluation of different base materials for high density flip chip on flex applications

Petteri Palm, J. Maattanen, Alain Picault et al. · Microelectronics International · 2001 · 18 citations

Engineering, Epoxy Matrix, Flip Chip Interconnections +19