Applied Physics Letters · 1983 · 48 citations · 12 references
Natural SciencesMaterials EngineeringMaterials ScienceChemical KineticsPhysical ChemistrySemiconductor MaterialsDiffusion In SolidsDislocations In SemiconductorsSilicon MaterialsChemical EtchingCold Neutron ScatteringDiffusion Coefficient CalculationDiffusion KineticsDiffusion MechanismsOxygen DiffusionSiliconTime Constant
The kinetics of oxygen precipitation in silicon have been determined from measurements of the IR 9-μm absorption band (4.2 K) and we obtain the time constant τ0 for the exponential approach to equilibrium for several temperatures. The density N of precipitate particles was measured directly by chemical etching, and inferred from IR scattering and cold neutron scattering. We use our values of τ0 and N to calculate the diffusion coefficient of oxygen in bulk silicon. This is the first time that this procedure has been used, and we obtain D=0.02 exp(−2.42 eV/kT) cm2 s−1 in the temperature range 650–1050 °C.
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Theory of diffusion-limited precipitation
Frank S. Ham · Journal of Physics and Chemistry of Solids · 1958 · 841 citations
Oxygen diffusion and thermal donor formation in silicon
U. G�sele, T. Y. Tan · Applied Physics A · 1982 · 283 citations
Electrical and Optical Properties of Heat-Treated Silicon
W. Kaiser · Physical Review · 1957 · 258 citations
Diffusivity of oxygen in silicon during steam oxidation
J. C. Mikkelsen · Applied Physics Letters · 1982 · 183 citations