Applied Physics Express · 2011 · 28 citations · 18 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsPower ElectronicsSemiconductor DevicesField-effect TransistorsMetal-oxide-semiconductor Field-effect TransistorsSemiconductor HeterostructuresWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsCurrent DensityEnhancement-mode TransistorsGate DielectricsHeterostructure Field-effect TransistorsHeterostructure TransistorsInsulated-gate Field-effect TransistorsPower Electronics DevicesThreshold Voltage
This letter presents the dc characteristics of normally Off AlInN/AlN/GaN metal–oxide–semiconductor heterostructure field-effect transistors (MOS-HFETs). The devices were fabricated using a recessed gate and SiON dielectric layers for gate isolation. For a device with a 1.5 µm gate length and an 8-µm-long channel, the threshold voltage was above +1.5 V and a maximum drain current density of 0.7 A/mm was reached under 6 V gate bias. These enhancement-mode MOS-HFETs have an excellent potential for power electronics applications.
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