Journal of Applied Physics · 1964 · 26 citations · 7 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsCurrent-voltage CharacteristicsDevice ReliabilityP-n JunctionsSemiconductor ReliabilitySilicon MaterialsWide Band Gap SemiconductorsAvalanche BreakdownBreakdown CharacteristicsBreakdown MechanismsBreakdown VoltageEnergy Band GapJunction BreakdownMechanical Stress ResponseP-n Junction Characteristics
A reversible reduction of breakdown voltage is observed when mechanical stress is applied to silicon p-n junctions. This effect can best be investigated in junctions exhibiting uniform avalanche breakdown. When uniaxial stress is applied the normalized reduction of breakdown voltage ΔV/VB is proportional to stress, the proportionality constant being of the order of 10−12 dyn−1 cm2. When stress is applied by means of a flat stylus, ΔV/VB is proportional to the load, when a spherical stylus is used, ΔV/VB is proportional to the cube root of load. It can be shown that the relative current change for a given force is to a first approximation independent of diode area and breakdown voltage VB. It is proposed that the effect is caused by reduction of the energy gap.
7
Handbook of engineering fundamentals
O. W. Eshbach · Journal of the Franklin Institute · 1952 · 163 citations · Full text
Uniform Silicon <i>p-n</i> Junctions. I. Broad Area Breakdown
R. L. Batdorf, A. G. Chynoweth, G. C. Dacey et al. · Journal of Applied Physics · 1960 · 87 citations
Pressure Dependence of the Resistivity of Silicon
William Paul, G. L. Pearson · Physical Review · 1955 · 81 citations