Nanotechnology · 2013 · 34 citations · 38 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDopingNanoelectronicsQuantum ConfinementSemiconductor Device MaterialsSemiconductor PhysicsSilicon MaterialsConductanceConductance ModulationCrystalline SiliconLateral ConfinementMonolithic ArchitectureSemiconductor Doping ProfilesSiliconSilicon Doping
Three-dimensional (3D) control of dopant profiles in silicon is a critical requirement for fabricating atomically precise transistors. We demonstrate conductance modulation through an atomic scale 3 nm wide δ-doped silicon-phosphorus wire using a vertically separated epitaxial doped Si:P top-gate. We show that intrinsic crystalline silicon grown at low temperatures (∼250 °C) serves as an effective gate dielectric permitting us to achieve large gate ranges (∼2.6 V) with leakage currents below 1 pA. Combining scanning tunneling lithography for precise lateral confinement, with monolayer doping and low temperature epitaxial overgrowth for precise vertical confinement, we can realize multiple layers of nano-patterned dopants in a single crystal material. These results demonstrate the viability of highly doped, vertically separated epitaxial gates in an all-crystalline architecture with long-term implications for monolithic 3D silicon circuits and for the realization of atomically precise donor architectures for quantum computing.
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Leo P. Kouwenhoven, D. G. Austing, Seigo Tarucha · Reports on Progress in Physics · 2001 · 1.1K citations
Martin Fuechsle, Jill A. Miwa, Suddhasatta Mahapatra et al. · Nature Nanotechnology · 2012 · 855 citations
Three-dimensional integrated circuits
Anna W. Topol, Douglas Charles La Tulipe, D.J. Frank et al. · IBM Journal of Research and Development · 2006 · 701 citations
Engineering, Computer Engineering, Electrical Engineering +17