Processing treatment of a lead-free Sn–Ag–Cu–Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection

Physics and materials challenges for lead-free solders

K. N. Tu, Andriy Gusak, M. Li · Journal of Applied Physics · 2003 · 356 citations

Engineering, Materials Engineering, Materials Science +17

On the Sn-Bi-Ag ternary phase diagram

Ursula R. Kattner, W. J. Boettinger · Journal of Electronic Materials · 1994 · 185 citations

Natural Sciences, Materials Engineering, Materials Science +12

Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints

Steffen Wiese, Andreas Schubert, H. Walter et al. · 2001 · 133 citations

Natural Sciences, Materials Engineering, Materials Science +14

Getting Ready for Lead‐free Solders*

N.‐C. Lee · Soldering and Surface Mount Technology · 1997 · 112 citations

Natural Sciences, Materials Engineering, Materials Science +14

Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders

Andreas Schubert, H. Walter, R. Dudek et al. · 2001 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +17