Publication | Closed Access
Failure analysis of integrated devices by scanning thermal microscopy (SThM)
50
Citations
5
References
1998
Year
Electrical EngineeringEngineeringHardware ReliabilityMicroscopyMicrofabricationApplied PhysicsFailure AnalysisEngineering Failure AnalysisElectronic PackagingInstrumentationMicroelectronicsThermal EngineeringPhysic Of FailureDevice Reliability
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