Electronics Letters · 1995 · 86 citations · 4 references
EngineeringElectrical EngineeringOptical MaterialsOptoelectronicsPhotonicsIntegrated OpticsIntegrated PhotonicsOptical Communication SystemsOptical WaveguidesPhotonic Integrated CircuitsSilicon PhotonicsFlip-chip BondingFlip-chip PackagingIntegrated Optical WaveguidesIntegrated Waveguide CircuitsIntegrated WaveguidesOptical PackagingOptical ReceiversOptical Transmitters
The authors have fabricated an optical WDM module with a simple configuration using a PLC platform together with a spot-size converted LD (SS-LD) and a waveguide PD (WG-PD). Since the module can be formed simply by flip-chip bonding of the SS-LD and the WG-PD, this configuration reduces the number of components, and thus helps achieve a cost reduction.
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