Transfer function approach to quantum control- part I: dynamics of quantum feedback systems

M. Yanagisawa, Hidenori Kimura

IEEE Transactions on Automatic Control

Quantum DynamicEngineeringControl- PartBosonic ModesQuantum Logic +14

Transfer function approach to quantum control- part II: control concepts and applications

M. Yanagisawa, Hidenori Kimura

IEEE Transactions on Automatic Control

Quantum DynamicEngineeringQuantum ComputingQuantum Mechanical PropertyQuantum Simulation +14

High-density integrated planar lightwave circuits using SiO/sub 2/-GeO/sub 2/ waveguides with a high refractive index difference

S. Suzuki, M. Yanagisawa, Y. Hibino, +1

Journal of Lightwave Technology

WaveguidesOptical MaterialsEngineeringSio/sub 2/-Geo/sub 2/Metamaterials +19

Application of planar lightwave circuit platformto hybrid integrated optical WDM transmitter/receiver module

Yuki Yamada, S. Suzuki, K. Moriwaki, +10

Electronics Letters

Corrosion-resisting Co-Pt thin film medium for high density recording

M. Yanagisawa, N. Shiota, Hodaka YAMAGUCHI, +1

IEEE Transactions on Magnetics

Thin Film PhysicsEngineeringThin Film Process TechnologyNew Material MediumHigh Density +15

Production process and high density recording characteristics of plated disks

Y. Suganuma, Hiroaki Tanaka, M. Yanagisawa, +2

IEEE Transactions on Magnetics

Materials EngineeringMaterials ScienceHigh DensityTribological CoatingEngineering +8

Mechanical properties of thin films: Measurements of ultramicroindentation hardness, Young's modulus and internal stress

Yuji Tsukamoto, Hodaka YAMAGUCHI, M. Yanagisawa

Thin Solid Films

Materials ScienceEngineeringMechanical PropertiesMechanical EngineeringApplied Physics +8

New structure of silica-based planar lightwave circuits for low-power thermooptic switch and its application to 8 × 8 optical matrix switch

Ryoichi Kasahara, M. Yanagisawa, Takashi Goh, +4

Journal of Lightwave Technology

Optical MaterialsEngineeringMatrix SwitchOptoelectronic DevicesProgrammable Photonics +19

Multichip optical hybrid integration technique with planar lightwave circuit platform

Toshikazu Hashimoto, Yoshinori Nakasuga, Yosuke Yamada, +6

Journal of Lightwave Technology

Two-step Bonding TechniqueOptical MaterialsEngineeringDevice IntegrationCircuit Platform +15

Low-power consumption silica-based 2 x 2 thermooptic switch using trenched silicon substrate

Ryoichi Kasahara, M. Yanagisawa, A. Sugita, +4

IEEE Photonics Technology Letters

Optical MaterialsEngineeringX 2Optoelectronic DevicesMicro-optical Component +16