Analysis of thermoelectric cooler performance for high power electronic packages

Current and future miniature refrigeration cooling technologies for high power microelectronics

Patrick E. Phelan, Victor Adrian Chiriac, T.-Y.T. Lee · IEEE Transactions on Components and Packaging Technologies · 2002 · 165 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Analysis of Thermoelectric Coolers by a Spice-Compatible Equivalent-Circuit Model

Simon Lineykin, S. Ben‐Yaakov · IEEE Power Electronics Letters · 2005 · 107 citations

Engineering, Electrical Engineering, Circuit Theory +16

An Assessment of Module Cooling Enhancement With Thermoelectric Coolers

Robert E. Simons, Michael Ellsworth, Richard C. Chu · Journal of Heat Transfer · 2005 · 71 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Air-cooling extension - performance limits for processor cooling applications

L. Sauciuc, G. Chrysler, Ravi Mahajan et al. · 2003 · 64 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling

Hengyun Zhang, D. Pinjala, Poi-Siong Teo · 2004 · 63 citations

Engineering, Electrical Engineering, Materials Engineering +17