3
Publications
225
Citations
3
H-Index
2002
Active since
Affiliations
Y.C. Mui is an author at Advanced Micro Devices (United States) specializing in engineering, electronic packaging, and microelectronics.
Top concepts
EngineeringElectronic PackagingCorrosionMaterial ScienceMicroelectronicsElectrical EngineeringMechanical EngineeringHeat TransferMicrostructureThermodynamics
Publications per year
2002–2009
3
3
Reliability Study on Copper Pillar Bumping with Lead Free Solder
YU Jin-hua, Ashok Anand, Y.C. Mui et al. · 2007 · 22 citations
Missing solder ball failure mechanisms in plastic ball grid array packages
Chong Zhong, Sung Yi, Y.C. Mui et al. · 2002 · 22 citations
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