Integration of a high density Ta2O5 MIM capacitor following 3D damascene architecture compatible with copper interconnects - Concepedia

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Integration of a high density Ta2O5 MIM capacitor following 3D damascene architecture compatible with copper interconnects

15

Citations

2

References

2006

Year

M. Thomas, A. Farcy, Nicolas Gaillard, C. Perrot, M. Gros‐Jean, I. Maťko, M. Cordeau, W. Saikaly, M. Proust, P. Caubet,

Microelectronic Engineering

Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringThree-dimensional Heterogeneous IntegrationDamascene ArchitectureCopper InterconnectsMicroelectronics

References

	Year	Citations

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