High Density Interconnect for Advanced VLSI Packaging - Concepedia

Concepedia

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High Density Interconnect for Advanced VLSI Packaging

10

Citations

0

References

1991

Year

Arnol Adams, R.S. Bentson, W.J. Bertram, H. J. Levinstein, W.Q. McKnight, J. J. Rubin, Bernd Haar

Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum

Advanced PackagingAdvanced Vlsi PackagingElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Electronic PackagingMicroelectronicsInterconnect (Integrated Circuits)

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