W.J. Bertram - Concepedia

Author

W.J. Bertram

Analog Devices (United States)

Also Known As

W. Bertram, W. J. Bertram, W.J. Bertram

Publications

461

Citations

H-Index

Concepts

All Affiliations

Analog Devices (United States)

About

W.J. Bertram is an author at Analog Devices (United States) specializing in engineering, electrical engineering, and instrumentation.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	422
2	Electrical Engineering	8	8	364
3	Applied Physics	5	5	284
4	Computer Engineering	4	4	196
5	Health Sciences	2	2	172

W.J. Bertram

Publications

422

Citations

H-Index

Page 1

	Year	Citations
Charge-coupled imaging devices: Experimental results M.F. Tompsett, G. F. Amelio, W.J. Bertram, IEEE Transactions on Electron Devices EngineeringMicroscopyImage SensorCharge InjectionAnalog Delay Line	1971	115
Linearized Dispersion Relation and Green's Function for Discrete-Charge-Transfer Devices with Incomplete Transfer W. B. Joyce, W.J. Bertram Bell System Technical Journal Electrical EngineeringEngineeringPhysicsBivariate DistributionApplied Physics	1971	68
Elimination of latch up in bulk CMOS Robert Payne, W.N. Grant, W.J. Bertram EngineeringVlsi DesignComputer EngineeringComputer ArchitectureBulk Cmos	1980	58
Charge-coupled imaging devices: Design considerations G. F. Amelio, W.J. Bertram, M.F. Tompsett IEEE Transactions on Electron Devices Electrical EngineeringEngineeringHealth SciencesMedical ImagingMicroscopy	1971	57
Multi-chip packaging technology for VLSI-based systems H. J. Levinstein, Charles Bartlett, W.J. Bertram Electrical EngineeringConventional PackagingEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)	1987	39
A three-level metallization three-phase CCD W.J. Bertram, A.M. Mohsen, Frank Morris, IEEE Transactions on Electron Devices Materials ScienceElectrical EngineeringElectronic DevicesBulk State DensitiesSemiconductor Interfaces	1974	34
A charge-coupled area image sensor and frame store Carlo H. Séquin, D.A. Sealer, W.J. Bertram, IEEE Transactions on Electron Devices Electrical EngineeringWhole ArrayMachine VisionImage AnalysisEngineering	1973	31
High Density Interconnect for Advanced VLSI Packaging Arnol Adams, R.S. Bentson, W.J. Bertram, Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum Advanced PackagingAdvanced Vlsi PackagingElectrical EngineeringChip-scale PackageEngineering	1991	10
Charge-coupled image-sensing devices using three levels of polysilicon Carlo H. Séquin, D.A. Sealer, W.J. Bertram, Electrical EngineeringPhotoelectric SensorCharge-coupled Image-sensing DevicesEngineeringSensors	1974	10

Page 1