Concepedia

Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

Kuo-Chung Hsu, Dung-Ching Perng, Jia-Bin Yeh, Yi-Chun Wang

Applied Surface Science · 2012 · 24 citations · 24 references

DOI

Concepts

References

24

The impurity-drag effect in grain boundary motion

John W. Cahn · Acta Metallurgica · 1962 · 1.5K citations

, , +12

Copper Metallization for High Performance Silicon Technology

R. Rosenberg, D. Edelstein, C.‐K. Hu et al. · Annual Review of Materials Science · 2000 · 423 citations

, , +16

Formation of copper silicides from Cu(100)/Si(100) and Cu(111)/Si(111) structures

Chin‐An Chang · Journal of Applied Physics · 1990 · 251 citations

, , +14

Electrodeposition of Copper Thin Film on Ruthenium

Oliver Chyan, Tiruchirapalli Arunagiri, Thomas Ponnuswamy · Journal of The Electrochemical Society · 2003 · 237 citations

, , +17

An introduction to Cu electromigration

Christine Hau-Riege · Microelectronics Reliability · 2004 · 222 citations

, , +8