Dung-Ching Perng

1-nm-thick graphene tri-layer as the ultimate copper diffusion barrier

Ba-Son Nguyen, Jen Fin Lin, Dung-Ching Perng · Applied Physics Letters · 2014 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +13

Thermal and Electrical Properties of PVD Ru(P) Film as Cu Diffusion Barrier

Dung-Ching Perng, Kuo-Chung Hsu, Shuo‐Wen Tsai et al. · Microelectronic Engineering · 2009 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +16

Enhancement of short-circuit current density in Cu2O/ZnO heterojunction solar cells

Dung-Ching Perng, Kuan‐Hung Chen, Kuan‐Hua Chen · Journal of Alloys and Compounds · 2016 · 40 citations

Engineering, Electrical Engineering, Materials Science +14

Phosphorous doped Ru film for advanced Cu diffusion barriers

Dung-Ching Perng, Jia-Bin Yeh, Kuo-Chung Hsu · Applied Surface Science · 2008 · 36 citations

Natural Sciences, Materials Engineering, Materials Science +10

Sub-centimeter micromachined electron microscope

Alan Feinerman, David A. Crewe, Dung-Ching Perng et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1992 · 33 citations

Engineering, Materials Engineering, Materials Science +11