Effect of d.c. bias on the deposition rate using r.f.–d.c. coupled magnetron sputtering for SnNx thin films

Room-temperature copper metallization for ultralarge-scale integrated circuits by a low kinetic-energy particle process

T. Ohmi, T. Saito, Tugumichi Shibata et al. · Applied Physics Letters · 1988 · 69 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Tin nitride thin films prepared by radio-frequency reactive sputtering

Toshiro Maruyama, Tomonori Morishita · Journal of Applied Physics · 1995 · 47 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Magnetron sputtered tin nitride

R.S. Lima, P. H. Dionísio, W. H. Schreiner et al. · Solid State Communications · 1991 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +7

Preparation of Ta/Mo structure by using RF-Dc coupled magnetron sputtering

Takeshi Tanaka, Kohei Kawabata · Thin Solid Films · 1998 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +9

Growth kinetics of refractory-metal thin films sputtered by r.f.-d.c. coupled magnetron sputtering in Ar or Ne gas plasma

Takeshi Tanaka, Keishi KAWABATA · Vacuum · 1995 · 10 citations

Natural Sciences, Materials Science, Physics +15