Localised laser joining of glass to silicon with BCB intermediate layer

MEMS post-packaging by localized heating and bonding

Liwei Lin · IEEE Transactions on Advanced Packaging · 2000 · 174 citations

Engineering, Materials Engineering, Materials Science +17

Soldering in electronics

G.W.A.D. · Microelectronics Reliability · 1984 · 157 citations

Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

Yu Cheng, Wan-Tai Hsu, K. Najafi et al. · Journal of Microelectromechanical Systems · 2002 · 156 citations

Engineering, Materials Engineering, Materials Science +14

Thin-film devices fabricated with benzocyclobutene adhesive wafer bonding

Ilse Christiaens, G. Roelkens, Kurt De Mesel et al. · Journal of Lightwave Technology · 2005 · 53 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Formation of Silicon-Gold Eutectic Bond Using Localized Heating Method

Liwei Lin, Yu-Ting Cheng Yu-Ting Cheng, Khalil Najafi · Japanese Journal of Applied Physics · 1998 · 50 citations

Engineering, Materials Engineering, Materials Science +16