EngineeringElectrical EngineeringCircuit TheoryMicroelectronicsSemiconductor DevicesCurrent-voltage CharacteristicsField-effect TransistorsIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsSemiconductor ReliabilityShort-channel EffectsBack-gated Field-effect TransistorsBreakdown MechanismsBreakdown VoltageHigh-voltage Breakdown
A novel concept of SOI BG REBULF (back-gate reduced bulk field), which breaks through the limitation of vertical breakdown voltage of lateral high-voltage SOI transistors, is proposed. The mechanism of the improved breakdown behaviour is the reduction of bulk electric field in silicon due to field-modulated effect of the interface charges induced by the back-gate voltage. The impact of the back-gate bias on the breakdown behaviour of over 600 V SOI LDMOS transistors is discussed. When the back-gate bias is 330 V,the breakdown voltage of the BG REBULF SOI LDMOS is 1020 V, which is 47.8% greater than that of the conventional SOI LDMOS.
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High voltage thin layer devices (RESURF devices)
J.A. Appels, H.M.J. Vaes · 1979 · 520 citations
A Novel 700-V SOI LDMOS With Double-Sided Trench
Xiaorong Luo, Bo Zhang, Zhaoji Li et al. · IEEE Electron Device Letters · 2007 · 106 citations