2014 · 106 citations · 8 references
EngineeringElectrical EngineeringMaterials EngineeringMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDevice ReliabilitySemiconductor Device MaterialsSemiconductor ReliabilityWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsCapacitanceConductionGallium Nitride Power DevicesGallium Nitride Power ElectronicsGate Dielectric EngineeringLeakagePassivationSurface Passivation Layers
This paper reports on an industrial DHEMT process for 650V rated GaN-on-Si power devices. The MISHEMT transistors use an in-situ MOCVD grown SiN as surface passivation and gate dielectric. Excellent off-state leakage, on-state conduction and low device capacitance and dynamic Ron is obtained. Initial assessment of the intrinsic reliability data on the in-situ SiN is provided.
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GaN on Si Technologies for Power Switching Devices
Masahiro Ishida, Tetsuzo Ueda, Tsuyoshi Tanaka et al. · IEEE Transactions on Electron Devices · 2013 · 411 citations
Normally-off high-voltage p-GaN gate GaN HFET with carbon-doped buffer
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Engineering, Electrical Engineering, Electronic Materials +15
Gate drive design considerations for high voltage cascode GaN HEMT
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