Applied Physics Letters · 2006 · 15 citations · 17 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsInterface ScienceSemiconductor MaterialsPhotoelectron SpectroscopySemiconductor Device MaterialsSemiconductor InterfacesSemiconductor PhysicsSilicon MaterialsX-ray Photoelectron SpectroscopyAnnealingAnnealing Time EffectsFermi Level PinningGate DielectricsInterfacial Reaction MechanismsInterfacial ReactionsNonstoichiometric OxidesOxygen Vacancies
We have investigated annealing-time dependence in interfacial reactions between polycrystalline-Si (poly-Si) electrodes and HfO2∕Si gate stacks using synchrotron radiation photoemission and x-ray absorption spectroscopy. From photoemission core-level spectra, we found that silicidation started at the upper interface between poly-Si electrodes and HfO2 gate dielectrics under the conditions of 700°C and 3min in ultrahigh vacuum. Before silicidation, we observed nonstoichiometric silicon oxide at the upper interface, suggesting the formation of oxygen vacancies which may cause Fermi level pinning. The interface layer between HfO2 gate dielectrics and Si substrates was changed into silicide by further annealing. In addition, from valence-band photoemission and O K-edge absorption spectra, we have found that the crystallization of HfO2 gate dielectrics is independent of silicidation.
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The Interface Phase and the Schottky Barrier for a Crystalline Dielectric on Silicon
R. A. McKee, F. J. Walker, Marco Buongiorno Nardelli et al. · Science · 2003 · 171 citations
Kenji Shiraishi, Keisaku Yamada, Kazuyoshi Torii et al. · Japanese Journal of Applied Physics · 2004 · 144 citations