GaN quantum-dots integrated in the gate dielectric of metal-oxide-semiconductor structures for charge-storage applications

Abstract

Gallium nitride quantum dots (QDs) were investigated as discrete charge storage nodes embedded in the gate dielectric of metal-oxide-semiconductor (MOS) capacitors. The GaN QDs were formed on top of 3.5 nm-thick SiO2/n-Si(001) substrates by radiofrequency plasma-assisted molecular beam deposition. The MOS structures were studied by transmission electron microscopy. Deposition dose was determined as a critical process parameter to obtain two dimensional arrays of discrete QDs. The memory window width, programming speed, and charge retention time were evaluated for GaN QD devices with different deposition doses. All devices showed enhanced electron trapping leading to significant memory windows. Charge retention measurements, at room temperature, revealed that the sample with the lowest concentration of QDs exhibits a low charge loss with a significant extrapolated programming window after 10 yrs. The present study not only demonstrates GaN QD embedded SiO2 structures fabricated by a fully complementary metal oxide semiconductor compatible method but also points out that these structures are promising for the realization of nanofloating gate non-volatile memory devices.