Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn–Zn eutectic alloy

Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Microelectronics Reliability · 2003 · 290 citations

Natural Sciences, Materials Engineering, Materials Science +11

Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation

Byeong‐Joo Lee, Nong‐Moon Hwang, Hyuck Mo Lee · Acta Materialia · 1997 · 268 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Young‐Sun Kim, Keun‐Soo Kim, Chi-Won Hwang et al. · Journal of Alloys and Compounds · 2003 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +10

Improved mechanical properties in new, Pb-free solder alloys

M. McCormack, S. Jin · Journal of Electronic Materials · 1994 · 168 citations

Natural Sciences, Materials Engineering, Materials Science +12

Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

Sung K. Kang, Da‐Yuan Shih, Donovan N. Leonard et al. · JOM · 2004 · 157 citations

Natural Sciences, Materials Engineering, Materials Science +15