Photobleachable silicon-containing molecular resist for deep UV lithography

Jin-Baek Kim, Ramakrishnan Ganesan, Jae‐Hak Choi, Hyo‐Jin Yun, Young‐Gil Kwon, Kyoung‐Seon Kim, Tae-Hwan Oh

Journal of Materials Chemistry · 2006 · 25 citations · 16 references

Concepts

Abstract

A novel molecular resist material based on polyhedral oligomeric silsesquioxane, possessing diazoketo groups, was successfully synthesized for deep UV lithography. The initial lithographic evaluation of the molecular resist shows the potential of the new platform for the next generation resists.

References

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