Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control

Matt Schaefer, R.A. Fournelle, Jin Liang · Journal of Electronic Materials · 1998 · 327 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Cheng–En Ho, Rung‐Ywan Tsai, Y. L. Lin et al. · Journal of Electronic Materials · 2002 · 325 citations

Natural Sciences, Materials Engineering, Materials Science +13

Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders

S. K. Kang, S. Purushothaman · Journal of Electronic Materials · 1996 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +12

A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni

Jang‐Zern Tsai, Yu Hu, Cheng‐Hsien Tsai et al. · Journal of Electronic Materials · 2003 · 158 citations

Natural Sciences, Materials Engineering, Materials Science +10