Concepedia
Microelectronics Reliability · 2010 · 13 citations · 15 references
Natural SciencesMaterials EngineeringMaterials SciencePolymer ChemistryPolymer EngineeringPolymer MaterialsAcrylic Resin MaterialsPolymer CharacterizationEpoxy CoatingsEpoxy FunctionalizationEpoxy ResinsResin Material Properties
15
Preparation and mechanical properties of modified epoxy resins with flexible diamines
Yang Guo, Shao‐Yun Fu, Jiao‐Ping Yang · Polymer · 2006 · 226 citations
Natural Sciences, Materials Engineering, Materials Science +13
Synthesis and characterization of imide ring and siloxane-containing cycloaliphatic epoxy resins
Zhiqiang Tao, Shiyong Yang, Jiansheng Chen et al. · European Polymer Journal · 2007 · 116 citations
Natural Sciences, Chemistry, Materials Science +7
Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film
Mohammad Afsar Uddin, M.O. Alam, Y.C. Chan et al. · Microelectronics Reliability · 2003 · 100 citations
Natural Sciences, Materials Engineering, Materials Science +17
Characterization of polymer matrix and low melting point solder for anisotropic conductive film
Yong‐Sung Eom, Jiwon Baek, Jong-Tae Moon et al. · Microelectronic Engineering · 2007 · 70 citations
Natural Sciences, Materials Engineering, Materials Science +16
Synthesis of a novel siloxane-containing diamine for increasing flexibility of epoxy resins
Soo‐Jin Park, Fan‐Long Jin, Junha Park et al. · Materials Science and Engineering A · 2005 · 55 citations
Natural Sciences, Chemistry, Materials Science +12