Concepedia

Byung-Seung Yim

BY

8

Publications

171

Citations

8

H-Index

2009

Active since

Affiliations

Chung-Ang University(Current)

Byung-Seung Yim is an author at Chung-Ang University specializing in engineering, materials science, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringMaterials EngineeringElectronic PackagingElectrical EngineeringMicrostructureElectrical InsulationNanomaterialsSolidification

Publications per year

2009–2014

8

Publications

8

Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging

Byung-Seung Yim, Yumi Kwon, Seung Hoon Oh et al. · Microelectronics Reliability · 2011 · 35 citations

Materials Science, Conductive Adhesives, Electrical Engineering +8

Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs)

Yumi Kwon, Byung-Seung Yim, Jongmin Kim et al. · Microelectronics Reliability · 2010 · 33 citations

Materials Science, Engineering, Hybrid Interconnection +7

Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Jong‐Min Kim · MATERIALS TRANSACTIONS · 2010 · 26 citations · Full text

Electrical Resistance, Engineering, Optical Microscope +16

Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Jong‐Min Kim, Sung-Ho Jeon et al. · MATERIALS TRANSACTIONS · 2009 · 23 citations · Full text

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +20

Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Jeong Il Lee, Yuseon Heo et al. · MATERIALS TRANSACTIONS · 2012 · 18 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +15

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