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Engineering, Automotive Engineering, Electrical Engineering +17

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

John G. Bai, Ziyang Zhang, Jesus N. Calata et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 370 citations

Engineering, Materials Engineering, Materials Science +17

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Tao Wang, Xu Chen, Guo‐Quan Lu et al. · Journal of Electronic Materials · 2007 · 341 citations

Natural Sciences, Materials Engineering, Materials Science +13

On the Ohno?Wang kinematic hardening rules for multiaxial ratcheting modeling of medium carbon steel

Xu Chen · International Journal of Plasticity · 2004 · 259 citations

Engineering, Materials Engineering, Materials Science +14

Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

Z. Zhang, Guo‐Quan Lu · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 216 citations

Natural Sciences, Materials Engineering, Materials Science +17