Publication | Closed Access

Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste

Materials ScienceEngineeringMicrofabricationAdhesive MaterialMechanical EngineeringChip AttachmentTensile BehaviorsNanoscale Silver PasteElectronic PackagingNanotribologyNanomechanics