Proceedings - IEEE International SOI Conference/Proceedings · 2007 · 15 citations · 1 references
EngineeringComputer EngineeringElectrical EngineeringHeat TransferMicroelectronicsSemiconductor DevicesIntegrated Circuit DesignIntegrated Circuit DevicesThermal DesignThermal ManagementThermal PerformanceThermal Properties Of Semiconductors3D Integrated CircuitsHeat DissipationThermal EffectsThermal Effects In Integrated CircuitsThermal Management Of Semiconductor DevicesThree-dimensional Heat TransferThree-dimensional Integrated Circuit LayoutThree-dimensional Integration
Thermal effects on different tiers of wafer-scale three dimensional (3D) integrated circuits were examined. The temperature was measured using pn diodes, and the heating effects on the characteristics of MOSFETs were compared. It is found that the circuit at the top of the 3D stack is the hottest. Adding metal plugs through the buried oxide or placing metal heat sink at the top surface improves heat dissipation.
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A wafer-scale 3-D circuit integration technology
J.A. Burns, Brian F. Aull, C.K. Chen et al. · IEEE Transactions on Electron Devices · 2006 · 269 citations