J.M. Knecht

A wafer-scale 3-D circuit integration technology

J.A. Burns, Brian F. Aull, C.K. Chen et al. · IEEE Transactions on Electron Devices · 2006 · 265 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +15

Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology

Vyshnavi Suntharalingam, R. Berger, J.A. Burns et al. · 2005 · 122 citations

Room Temperature, Electrical Engineering, 3D Ic Architecture +14

MEMS microswitches for reconfigurable microwave circuitry

S.M. Duffy, C. O. Bozler, S. Rabe et al. · IEEE Microwave and Wireless Components Letters · 2001 · 120 citations

Electrical Engineering, Engineering, Series Capacitance +10

MEMS microswitch arrays for reconfigurable distributed microwave components

C. O. Bozler, R. Drangmeister, S.M. Duffy et al. · 2002 · 63 citations

Mems Microswitch Arrays, Microwave Circuits, Electrical Engineering +13

Laser Radar Imager Based on 3D Integration of Geiger-Mode Avalanche Photodiodes with Two SOI Timing Circuit Layers

Brian F. Aull, J.A. Burns, C. Chen et al. · 2006 · 56 citations

Engineering, Geiger-mode Avalanche Photodiodes, Image Sensor +18