Properties of titanium-tungsten thin films obtained by magnetron sputtering of composite cast targets

Refractory silicides for integrated circuits

S. P. Murarka · Journal of Vacuum Science and Technology · 1980 · 601 citations

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Diffusion barrier properties of TiW between Si and Cu

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Fabrication of Highly Reliable Tungsten Gate MOS VLSI's

Naoki Yamamoto, Haruki Kume, Setsuo Iwata et al. · Journal of The Electrochemical Society · 1986 · 28 citations

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Titanium-tungsten contacts to silicon. II. Stability against aluminum penetration

S.E. Babcock, K. N. Tu · Journal of Applied Physics · 1986 · 17 citations

Engineering, Materials Engineering, Materials Science +17