The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor

Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires

Ute Geißler, Martin Schneider‐Ramelow, Klaus‐Dieter Lang et al. · Journal of Electronic Materials · 2006 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +11

Microelectronic Bonding Processes Monitored by Integrated Sensors

M. Mayer, J. Schwizer · Sensors Update · 2002 · 31 citations

Engineering, Materials Engineering, Materials Science +17

Predicting the Shear Strength of a Wire Bond Using Laser Vibration Measurements

Holger Gaul, Martin Schneider‐Ramelow, Klaus‐Dieter Lang et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +14

Analysis of the friction processes in ultrasonic wedge/wedge-bonding

Holger Gaul, Martin Schneider‐Ramelow, H. Reichl · Microsystem Technologies · 2009 · 24 citations

Engineering, Materials Engineering, Materials Science +12

Thermosonic ball bonding model based on ultrasonic friction power

Michael D. Mayer, R. Schwizer · 2004 · 17 citations

Engineering, Materials Engineering, Materials Science +14