J. Schwizer

Mechanical properties of thin films from the load deflection of long clamped plates

V. Ziebart, Oliver Paul, U. Münch et al. · Journal of Microelectromechanical Systems · 1998 · 96 citations

Engineering, Mechanical Engineering, Residual Stress +17

Thermosonic ball bonding: friction model based on integrated microsensor measurements

J. Schwizer, M. Mayer, Daniel Bolliger et al. · 2003 · 41 citations

Engineering, Mechanical Engineering, Nanotribology +18

Microelectronic Bonding Processes Monitored by Integrated Sensors

M. Mayer, J. Schwizer · Sensors Update · 2002 · 31 citations

Engineering, Device Integration, Soft Solder Die +16

Packaging test chip for flip-chip and wire bonding process characterization

J. Schwizer, Wan Ho Song, M. Mayer et al. · 2004 · 15 citations

Engineering, Mechanical Engineering, Packaging Process Characterization +16

Ultrasonic Bonding: Understanding How Process Parameters Determine the Strength of Au-Al Bonds

M. Mayer, J. Schwizer · 2008 · 13 citations