Wan Ho Song

Hotplate-based monolithic CMOS microsystems for gas detection and material characterization for operating temperatures up to 500/spl deg/C

Diego Barrettino, M. Gräf, Wan Ho Song et al. · IEEE Journal of Solid-State Circuits · 2004 · 62 citations

Engineering, Electrical Engineering, Microelectronics +16

More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode

Nhat Ly, Di Xu, Wan Ho Song et al. · Microelectronics Reliability · 2014 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +8

Analysis of the electrical characteristics and structure of Cu-Filled TSV with thermal shock test

Il Ho Jeong, Myong Hoon Roh, Flora Jung et al. · Electronic Materials Letters · 2014 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +13

Packaging test chip for flip-chip and wire bonding process characterization

J. Schwizer, Wan Ho Song, M. Mayer et al. · 2004 · 15 citations

Engineering, Electrical Engineering, Materials Science +17

Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability

Wan Ho Song, Chunjin Hang, Andrew Pequegnat et al. · Journal of Electronic Materials · 2009 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +6